Photonic integrated circuits - Introduction and roadmap for standardization has-digital Compliance with the best industry

Compliance with the best industry requirements on dimensions provided by BS EN IEC 63093-7 ensures mechanical interchangeability of complete assemblies and wound coil formers

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evaluation and procurement

Exchange of information and planning

Photonic integrated circuits - Introduction and roadmap for standardization has-digital Compliance with the best industry1 Scope This part of IEC 63072, which is a Technical Report, provides an introduction to photonic integrated circuits (PICs) and describes a roadmap for the standardization of PIC technology over the next decade. NOTE The trademarks and trade names mentioned in this document are given for the convenience of users of this document; this does not constitute an endorsement by IEC of these companies.